What is the correct sequence for a soldering procedure?

The correct sequence for a soldering procedure is crucial to ensure a strong and reliable solder joint. Starting with cleaning the surfaces to be soldered removes any dirt, oxidation, or grease that can interfere with the adhesion of the solder. This initial step is essential, as clean surfaces allow for better contact between the solder and the materials being joined.

After cleaning, the next step is rimming, which involves ensuring that the surfaces are properly edged or formed for optimal solder flow. This step may not be explicitly performed in every soldering instance but can be critical when dealing with certain types of connections or materials.

The following step is fluxing, which involves applying a flux to the joint area. Flux serves to further clean the surfaces during the heating process and prevents oxidation, promoting a good bond once the solder is applied. The assembly of the workpiece follows, where all components are positioned correctly and held in place for the soldering process.

Finally, soldering itself involves heating the joint and adding solder to form a strong connection. This sequence ensures that each step is performed methodically to achieve the best results in soldering.

In contrast, sequences that skip cleaning or do not follow the logical order of preparing the joint before soldering can lead to poor solder joints